DIM100PHM33-A000 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. 1/8 www.dynexsemi.com features 10 s short circuit withstand high thermal cycling capability non punch through silicon isolated mmc base with aln substrates applications high reliability inverters motor controllers traction auxiliaries the powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600v to 3300v and currents up to 3600a. the DIM100PHM33-A000 is a half bridge 3300v, n channel enhancement mode, insulated gate bipolar transistor (igbt) module. the igbt has a wide reverse bias safe operating area (rbsoa) plus full 10 s short circuit withstand. this device is optimised for applications requiring high thermal cycling capability. the module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. ordering information order as: DIM100PHM33-A000 note: when ordering, please use the whole part number. key parameters v ces 3300v v ce(sat) * (typ) 3.4v i c (max) 100a i c(pk) (max) 200a *(measured at the power busbars and not the auxiliary terminals) DIM100PHM33-A000 half bridge igbt module pds5708-1.3 january 2004 fig. 1 half bridge circuit diagram fig. 2 electrical connections - (not to scale) outline type code: p (see package details for further information) 3(e2) 2(c1) 1(e1/c2) 7(e 2) 6(g 2) 8(c 1) 5(e 1) 4(g 1) .com .com .com 4 .com u datasheet
DIM100PHM33-A000 2/8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com absolute maximum ratings - per arm stresses above those listed under 'absolute maximum ratings' may cause permanent damage to the device. in extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. appropriate safety precautions should always be followed. exposure to absolute maximum ratings may affect device reliability. t case = 25?c unless stated otherwise test conditions v ge = 0v - t case = 85?c 1ms, t case = 115?c t case = 25?c, t j = 150?c v r = 0, t p = 10ms, t vj = 125?c commoned terminals to base plate. ac rms, 1 min, 50hz iec1287. v 1 = 3500v, v 2 = 2600v, 50hz rms symbol v ces v ges i c i c(pk) p max i 2 t v isol q pd units v v a a w ka 2 s v pc max. 3300 20 100 200 1304 5 6000 10 parameter collector-emitter voltage gate-emitter voltage continuous collector current peak collector current max. transistor power dissipation diode i 2 t value (diode arm) isolation voltage - per module partial discharge - per module test conditions continuous dissipation - junction to case continuous dissipation - junction to case mounting torque 5nm (with mounting grease) transistor diode - mounting - m6 electrical connections - m5 parameter thermal resistance - transistor (per switch) thermal resistance - diode (per switch) thermal resistance - case to heatsink (per module) junction temperature storage temperature range screw torque symbol r th(j-c) r th(j-c) r th(c-h) t j t stg - units ?c/kw ?c/kw ?c/kw ?c ?c ?c nm nm max. 96 192 16 150 125 125 5 4 typ. - - - - - - - - min. - - - - - ?0 - - thermal and mechanical ratings internal insulation: aln clearance: 20mm baseplate material: alsic cti (critical tracking index): 175 creepage distance: 33mm .com .com .com .com 4 .com u datasheet
DIM100PHM33-A000 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. 3/8 www.dynexsemi.com electrical characteristics t case = 25?c unless stated otherwise. test conditions v ge = 0v, v ce = v ces v ge = 0v, v ce = v ces , t case = 125?c v ge = 20v, v ce = 0v i c = 10ma, v ge = v ce v ge = 15v, i c = 100a v ge = 15v, i c = 100a, , t case = 125?c dc t p = 1ms i f = 100a i f = 100a, t case = 125?c v ce = 25v, v ge = 0v, f = 1mhz v ce = 25v, v ge = 0v, f = 1mhz - - t j = 125?c, v cc = 2500v, i 1 t p 10 s, v ce(max) = v ces ?l*. di/dt i 2 iec 60747-9 parameter collector cut-off current gate leakage current gate threshold voltage collector-emitter saturation voltage diode forward current diode maximum forward current diode forward voltage input capacitance reverse transfer capacitance module inductance - per switch internal transistor resistance - per switch short circuit. i sc symbol i ces i ges v ge(th) v ce(sat) ? i f i fm v f ? c ies c res l m r int sc data units ma ma a v v v a a v v nf nf nh m ? a a max. 0.5 7.5 1 6.5 - - - - - - - - - - - - typ. - - - 5.5 3.4 4.4 100 200 2.5 2.5 23 0.33 30 0.54 650 550 min. - - - 4.5 - - - - - - - - - - - - note: ? measured at the power busbars and not the auxiliary terminals) l* is the circuit inductance + l m .com .com .com .com 4 .com u datasheet
DIM100PHM33-A000 4/8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com units ns ns mj ns ns mj c c a mj max. - - - - - - - - - - min. - - - - - - - - - - test conditions i c = 100a v ge = 15v v ce = 1800v r g(on) = r g(off) =20 ? l ~ 100nh i f = 100a, v r = 1800v, di f /dt = 500a/ s parameter turn-off delay time fall time turn-off energy loss turn-on delay time rise time turn-on energy loss gate charge diode reverse recovery charge diode reverse current diode reverse recovery energy electrical characteristics t case = 25?c unless stated otherwise symbol t d(off) t f e off t d(on) t r e on q g q rr i rr e rec t case = 125?c unless stated otherwise units ns ns mj ns ns mj c a mj max. - - - - - - - - - typ. 1400 250 105 550 250 220 75 75 100 min. - - - - - - - - - test conditions i c = 100a v ge = 15v v ce = 1800v r g(on) = r g(off) = 20 ? l ~ 100nh i f = 100a, v r = 1800v, di f /dt = 450a/ s parameter turn-off delay time fall time turn-off energy loss turn-on delay time rise time turn-on energy loss diode reverse recovery charge diode reverse current diode reverse recovery energy symbol t d(off) t f e off t d(on) t r e on q rr i rr e rec typ. 1350 200 75 550 250 150 1.25 40 70 55 .com .com .com .com 4 .com u datasheet
DIM100PHM33-A000 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. 5/8 www.dynexsemi.com typical characteristics fig. 3 typical output characteristics fig. 4 typical output characteristics fig. 5 typical switching energy vs collector current fig. 6 typical switching energy vs gate resistance 0 25 50 75 100 125 150 175 200 collector-emitter voltage, v ce - (v) collector current, i c - (a) 0123 45 6 v ge = 10v v ge = 12v v ge = 15v v ge = 20v common emitter t case = 25 ? c v ce is measured at power busbars and not the auxiliary terminals 0 25 50 75 100 125 150 175 200 02468 collector-emitter voltage, v ce - (v) collector current, i c - (a) 1357 v ge = 10v v ge = 12v v ge = 15v v ge = 20v common emitter t case = 125 ? c v ce is measured at power busbars and not the auxiliary terminals 0 25 50 75 100 125 150 175 200 225 250 0255075100 collector current, i c - (a) switching energy, e sw - (mj) conditions: t c = 125 c, r g = 20 ohms, v cc = 1800v, c ge = 66nf e on (mj) e off (mj) e rec (mj) 0 50 100 150 200 250 300 350 10 20 30 40 50 60 gate resistance, r g - (ohms) switching energy, e sw - (mj) e on (mj) e off (mj) e rec (mj) conditions: t c = 125 c i c = 100a v cc = 1800v c ge = 66nf .com .com .com .com 4 .com u datasheet
DIM100PHM33-A000 6/8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com fig. 7 diode typical forward characteristics fig. 8 reverse bias safe operating area fig. 9 di ode reverse bias safe operating area fig. 10 transient thermal impedance 0 25 50 75 100 125 150 175 200 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 forward voltage, v f - (v) forward current, i f - (a) t j = 25 ? c t j = 125 ? c v f is measured at power busbars and not the auxiliary terminals 0 50 100 150 200 250 0 500 1000 1500 2000 2500 3000 3500 collector emitter voltage, v ce - (v) collector current, i c - (a) t case = 125 ? c v ge = 15v r g(min) = 20 ohms module i c chip i c 0 25 50 75 100 125 150 175 200 0 500 1000 1500 2000 2500 3000 3500 reverse voltage, v r - (v) reverse recovery current, i rr - (a) t j = 125 ? c igbt r i (?c/kw) i (ms) diode r i (?c/kw) i (ms) 1 3.58 0.13 8.6 0.13 2 22.52 5.80 45.04 5.80 3 31.54 48.03 63.06 48.03 4 38.22 248.53 76.46 248.53 diode transistor 1 10 100 1000 0.001 0.01 1 0.1 10 pulse width, t p - (s) transient thermal impedance, z th (j-c) - ( c/kw ) .com .com .com .com 4 .com u datasheet
DIM100PHM33-A000 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. 7/8 www.dynexsemi.com package details for further package information, please visit our website or contact customer services. all dimensions in mm, unless stated o therwise. do not scale. nominal weight: 750g module outline type code: p 3(e2) 2(c1) 1(e1/c2) 7(e 2 ) 6(g 2 ) 8(c 1 ) 5(c 2 /e 1 ) 4(g 1 ) fig. 11 package details .com .com .com .com 4 .com u datasheet
www.dynexsemi.com power assembly capability the power assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. we offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today . the assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. using the latest cad methods our team of design and applications engineers aim to provide the power assembly complete solution (pacs). heatsinks the power assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of dynex semiconductors. data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. for further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer services. customer service tel: +44 (0)1522 502753 / 502901. fax: +44 (0)1522 500020 sales offices benelux, italy & switzerland: tel: +33 (0)1 64 66 42 17. fax: +33 (0)1 64 66 42 19. france: tel: +33 (0)2 47 55 75 5 3 . fax: +33 (0)2 47 55 75 59. germany, northern europe, spain & rest of world: tel: +44 (0)1522 502753 / 502901. fax: +44 (0)1522 500020 north america: tel: (440) 259-2060. fax: (440) 259-2059. tel: (949) 733-3005. fax: (949) 733-2986. these offices are supported by representatives and distributors in many countries world-wide. ?dynex semiconductor 2003 technical documentation ?not for resale. produced in united kingdom headquarters operations dynex semiconductor ltd doddington road, lincoln. lincolnshire. ln6 3lf. united kingdom. tel: +44-(0)1522-500500 fax: +44-(0)1522-500550 this publication is issued to provide information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. no warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. the company reserves the right to alter without prior notice the specification, design or price of any product or service. information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. it is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. these products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. all products and materials are sold and services provided subject to the company's conditions of sale, which are available on request. all brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com .com .com .com 4 .com u datasheet
|
